
During the meeting, the two sides discussed directions for collaboration in training and developing high-quality human resources in core technology fields such as semiconductor chips and unmanned aerial vehicles (UAVs).




Notably, the meeting opened up numerous promising prospects for collaboration, paving the way for a strategic partnership agreement between the two parties to expand the nationwide network of semiconductor chip and UAV laboratories, while simultaneously training a new generation of young talents to meet the development demands of the digital technology era.



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20/01/2026
16/01/2026
14/01/2026